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US07791573B2 Etching solution for multiple layer of copper and molybdenum and etching method using the same 有权
蚀刻溶液用于多层铜和钼的蚀刻方法使用

Etching solution for multiple layer of copper and molybdenum and etching method using the same
Abstract:
An etching solution for a multiple layer of copper and molybdenum includes: about 5% to about 30% by weight of a hydrogen peroxide; about 0.5% to about 5% by weight of an organic acid; about 0.2% to about 5% by weight of a phosphate; about 0.2% to about 5% by weight of a first additive having nitrogen; about 0.2% to about 5% by weight of a second additive having nitrogen; about 0.01% to about 1.0% by weight of a fluoric compound; and de-ionized water making a total amount of the etching solution 100% by weight.
Abstract(Chinese):

用于多层铜和钼的蚀刻溶液包括：约5％至约30％重量的过氧化氢; 约0.5重量％至约5重量％的有机酸; 约0.2重量％至约5重量％的磷酸盐; 约0.2重量％至约5重量％的具有氮的第一添加剂; 约0.2重量％至约5重量％的具有氮气的第二添加剂; 约0.01重量％至约1.0重量％的氟化合物; 和去离子水，使总量的蚀刻溶液100重量％。

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