Invention Grant
US07791625B2 Thermalhead, method for manufacture of same, and printing device provided with same
有权
热封头，其制造方法以及具有该打印头的打印装置
- Patent Title: Thermalhead, method for manufacture of same, and printing device provided with same
- Patent Title (中): 热封头，其制造方法以及具有该打印头的打印装置
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Application No.: US12325094Application Date: 2008-11-28
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Publication No.: US07791625B2Publication Date: 2010-09-07
- Inventor: Hiroshi Yamada , Kazuhito Uchida , Tadashi Iino , Suguru Andoh , Hayato Miyashita
- Applicant: Hiroshi Yamada , Kazuhito Uchida , Tadashi Iino , Suguru Andoh , Hayato Miyashita
- Applicant Address: JP Tokyo
- Assignee: TDK Corporation
- Current Assignee: TDK Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2007-310649 20071130; JP2008-024908 20080205
- Main IPC: B41J2/335
- IPC: B41J2/335
Abstract:
A thermal head that includes a bonding portion and a protective layer. The thermal head prevents electrostatic discharge damage from occurring in the bonding portion of the thermal head due to the protective layer being electrostatically charged.
Public/Granted literature
- US20090174758A1 THERMALHEAD, METHOD FOR MANUFACTURE OF SAME, AND PRINTING DEVICE PROVIDED WITH SAME Public/Granted day:2009-07-09
Information query
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