An interconnect substrate for use in a liquid crystal module is nearly rectangular in shape as seen in a plan view. Connector portions having a connector pattern that provides electrical connection between the interconnect substrate and the controller substrate are provided one for each end of the interconnect substrate in a longer-side direction thereof. A plurality of connection portions that provide connection between the interconnect substrate and the driver substrate are formed along one side of the interconnect substrate running in the longer-side direction thereof so as to be symmetrical with respect to a normal S that divides the one side into two equal parts. The conductor traces interconnecting the driver substrate and the controller substrate are formed so as to be symmetrical with respect to the normal S.