Invention Grant
- Patent Title: Semiconductor manufacturing peripheral verification tool
- Patent Title (中): 半导体制造外设验证工具
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Application No.: US11967411Application Date: 2007-12-31
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Publication No.: US07791720B2Publication Date: 2010-09-07
- Inventor: Mohd Zuraimi Md Yusof
- Applicant: Mohd Zuraimi Md Yusof
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Yingsheng Tung; Wade J. Brady, III; Frederick J. Telecky, Jr.
- Main IPC: G01N21/00
- IPC: G01N21/00

Abstract:
Apparatus and methods for verification of the dimensions of a semiconductor manufacturing peripheral are disclosed, in which the peripheral, e.g., a wafer cassette, is positioned between, and is enveloped by, an emitter housing and an opposing receiver housing adapted for emitting and receiving, respectively, light from a selected portion of the electromagnetic spectrum, preferably infrared. The measured light is used to verify the dimensions of the target peripheral in comparison with a pre-selected standard.
Public/Granted literature
- US20090168055A1 Semiconductor Manufacturing Peripheral Verification Tool Public/Granted day:2009-07-02
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