Invention Grant
- Patent Title: Thin film device having thin film coil wound on magnetic film
- Patent Title (中): 具有缠绕在磁性膜上的薄膜线圈的薄膜器件
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Application No.: US11727502Application Date: 2007-03-27
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Publication No.: US07791837B2Publication Date: 2010-09-07
- Inventor: Toshiyasu Fujiwara
- Applicant: Toshiyasu Fujiwara
- Applicant Address: JP Tokyo
- Assignee: TDK Corporation
- Current Assignee: TDK Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2006-098574 20060331; JP2006-098575 20060331
- Main IPC: G11B5/147
- IPC: G11B5/147
Abstract:
A thin film device is provided, in which inductance can be increased when a thin film coil wound on a magnetic film is provided. In a thin film coil wound on a magnetic film, thickness of lower coil portions is smaller than thickness of upper coil portions. Consequently, a magnetic property (permeability) tends to be hardly deteriorated.
Public/Granted literature
- US20070230042A1 Thin film device Public/Granted day:2007-10-04
Information query
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