Invention Grant
- Patent Title: Heat-dissipating mechanism for use with memory module
- Patent Title (中): 与内存模块一起使用的散热机构
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Application No.: US12468636Application Date: 2009-05-19
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Publication No.: US07791881B2Publication Date: 2010-09-07
- Inventor: Chia-Hsing Chou , Chih-Wei Tsai , Chia-Hung Lu
- Applicant: Chia-Hsing Chou , Chih-Wei Tsai , Chia-Hung Lu
- Applicant Address: TW Taipei
- Assignee: Asustek Computer Inc.
- Current Assignee: Asustek Computer Inc.
- Current Assignee Address: TW Taipei
- Agency: Kirton & McConkie
- Agent Evan R. Witt
- Priority: TW97121750A 20080611
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
A heat-dissipating mechanism includes a first heat-dissipating device, a first positioning device, a second heat-dissipating device and a second positioning device. The first heat-dissipating device is contacted with a memory module. The first positioning device is disposed on the first heat-dissipating device and includes a protrusion. The second heat-dissipating device is connected with the first heat-dissipating device. The second positioning device has a positioning rail formed in the second heat-dissipating device and corresponding to the protrusion. The second heat-dissipating device is connected with the first heat-dissipating device when the protrusion of the first positioning device is embedded into the positioning rail second positioning device.
Public/Granted literature
- US20090310295A1 HEAT-DISSIPATING MECHANISM FOR USE WITH MEMORY MODULE Public/Granted day:2009-12-17
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