Invention Grant
- Patent Title: Contour surface cooling of electronics devices
- Patent Title (中): 电子设备的轮廓表面冷却
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Application No.: US12029749Application Date: 2008-02-12
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Publication No.: US07791887B2Publication Date: 2010-09-07
- Inventor: Evgeni Ganev , Robert Dietrich , Michael Quan
- Applicant: Evgeni Ganev , Robert Dietrich , Michael Quan
- Applicant Address: US NJ Morristown
- Assignee: Honeywell International Inc.
- Current Assignee: Honeywell International Inc.
- Current Assignee Address: US NJ Morristown
- Agent Oral Caglar, Esq.
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01G2/08
Abstract:
The present invention provides a cooling device including a heat generating device having a device surface with a device surface contour on at least a portion of the device surface and a base having a base surface with a base surface contour on at least a portion of the base surface. The device surface contour and the base surface contour are substantially similar such that at least a portion of the device surface and the base surface fit in close proximity to each other.
Public/Granted literature
- US20090201648A1 CONTOUR SURFACE COOLING OF ELECTRONICS DEVICES Public/Granted day:2009-08-13
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