Invention Grant
- Patent Title: Providing an embedded capacitor in a circuit board
- Patent Title (中): 在电路板中提供嵌入式电容器
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Application No.: US11820570Application Date: 2007-06-20
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Publication No.: US07791896B1Publication Date: 2010-09-07
- Inventor: Jun Fan , James L. Knighten , Norman W. Smith
- Applicant: Jun Fan , James L. Knighten , Norman W. Smith
- Applicant Address: US OH Miamisburg
- Assignee: Teradata US, Inc.
- Current Assignee: Teradata US, Inc.
- Current Assignee Address: US OH Miamisburg
- Agency: Trop, Pruner & Hu P.C.
- Main IPC: H05K1/16
- IPC: H05K1/16
Abstract:
A circuit board includes power reference layers and a capacitor provided between the power reference layers such that a shorter dimension of the capacitor defines a space between the power reference layers. The capacitor has plural conductive plates and plural dielectric layers.
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