A semiconductor memory device is configured to vertically stack a plurality of memory chips using a resistance-change memory element as a memory cell in one package. The memory chips each have first and second memory position detection pads connected via chip top and bottom electrodes facing each other. Of the vertically stacked memory chips, the lowermost memory chip is provided with the connected chip bottom electrodes of the first and second memory position detection pads. The memory chips each control the variable resistance element, and in a state that the first memory position detection pad has a higher resistance than the second memory position detection pad, compare a voltage applied to the first memory position detection pad with the chip position detection signal using the comparator when a voltage is applied between the first and second memory position detection pads provided on the uppermost layer memory chip.