Invention Grant
- Patent Title: SEU hardening circuit and method
- Patent Title (中): SEU硬化电路及方法
-
Application No.: US11944434Application Date: 2007-11-22
-
Publication No.: US07791926B2Publication Date: 2010-09-07
- Inventor: Palkesh Jain
- Applicant: Palkesh Jain
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Dawn V. Stephens; Wade James Brady, III; Frederick J. Telecky, Jr.
- Main IPC: G11C11/00
- IPC: G11C11/00

Abstract:
An SEU hardening circuit and method is disclosed. In one embodiment, a method includes providing a semiconductor memory component having a pair of pMOS transistors and a pair of nMOS transistors, tying a first pMOS body terminal of a first pMOS transistor of the pair of pMOS transistors to a second pMOS gate terminal of a second pMOS transistor of the pair of pMOS transistors, and tying at least a first pre-designated body terminal of at least one transistor selected from the group including essentially of a pair of pMOS transistors and a pair of nMOS transistors to at least a second pre-designated terminal of at least one pre-designated transistor selected from the group including essentially of the pair of pMOS transistors and the pair of nMOS transistors.
Public/Granted literature
- US20090135643A1 SEU HARDENING CIRCUIT AND METHOD Public/Granted day:2009-05-28
Information query