Invention Grant
- Patent Title: Panel attachment assembly, panel attachment method and telephone
- Patent Title (中): 面板附件总成,面板附件方式和电话
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Application No.: US11896026Application Date: 2007-08-29
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Publication No.: US07792283B2Publication Date: 2010-09-07
- Inventor: Shinichi Yoshida , Kenji Nitobe
- Applicant: Shinichi Yoshida , Kenji Nitobe
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Pillsbury Winthrop Shaw Pittman, LLP
- Priority: JP2006-233797 20060830
- Main IPC: H04M9/00
- IPC: H04M9/00 ; H04M1/00

Abstract:
According to one embodiment, a panel attachment assembly comprises a housing including a first wall with an opening, a cover panel fitted in the opening, and a built-in component fixed in the housing. The housing includes a first end edge defined by the first and second walls, and a second end edge defined by the first and third walls. The cover panel includes a first end face aligned with the first end edge and seen from the outside, a second end face aligned with the second end edge and seen from the outside, and flanges projecting from side edges. The built-in component has engagement sections at positions corresponding to ends of the flanges. These ends of the flanges contact the engagement sections, and the other ends contact the housing between the first wall and built-in component.
Public/Granted literature
- US20080056486A1 Panel attachment assembly, panel attachment method and telephone Public/Granted day:2008-03-06
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