Invention Grant
- Patent Title: Wafer center finding
- Patent Title (中): 晶圆中心查找
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Application No.: US11682306Application Date: 2007-03-05
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Publication No.: US07792350B2Publication Date: 2010-09-07
- Inventor: Chris Kiley , Peter van der Meulen , Forest Buzan , Paul E. Fogel
- Applicant: Chris Kiley , Peter van der Meulen , Forest Buzan , Paul E. Fogel
- Applicant Address: US MA Chelmsford
- Assignee: Brooks Automation, Inc.
- Current Assignee: Brooks Automation, Inc.
- Current Assignee Address: US MA Chelmsford
- Agency: Perman & Green, LLP
- Agent Richard Pickreign
- Main IPC: G06K9/00
- IPC: G06K9/00 ; G06K9/36
Abstract:
A number of wafer center finding methods and systems are disclosed herein that improve upon existing techniques used in semiconductor manufacturing.
Public/Granted literature
- US20070285673A1 WAFER CENTER FINDING Public/Granted day:2007-12-13
Information query
