Invention Grant
- Patent Title: Method and apparatus for inspecting pattern defects
- Patent Title (中): 检查图案缺陷的方法和装置
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Application No.: US12123160Application Date: 2008-05-19
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Publication No.: US07792352B2Publication Date: 2010-09-07
- Inventor: Kaoru Sakai , Shunji Maeda , Takafumi Okabe
- Applicant: Kaoru Sakai , Shunji Maeda , Takafumi Okabe
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Technologies Corporation
- Current Assignee: Hitachi High-Technologies Corporation
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2003-390655 20031120
- Main IPC: G06K9/00
- IPC: G06K9/00

Abstract:
An apparatus for inspecting pattern defects, the apparatus including: a defect candidate extraction unit configured to perform a defect candidate extraction process by comparing a detected image signal with a reference image signal; and a defect detection unit configured to perform a defect detection process and a defect classification process based on a partial image containing a defect candidate that is extracted by the defect candidate extraction unit, wherein the processes performed by the defect candidate extraction unit and/or the defect detection unit are performed asynchronously with an image acquisition process.
Public/Granted literature
- US20080232674A1 METHOD AND APPARATUS FOR INSPECTING PATTERN DEFECTS Public/Granted day:2008-09-25
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