Invention Grant
- Patent Title: Material processing system and a material processing method including a saw station and an interface with touch screen
- Patent Title (中): 材料加工系统和材料加工方法，包括锯台和与触摸屏的界面
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Application No.: US11895285Application Date: 2007-08-22
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Publication No.: US07792602B2Publication Date: 2010-09-07
- Inventor: Spencer B. Dick
- Applicant: Spencer B. Dick
- Applicant Address: US WA Vancouver
- Assignee: Precision Automation, Inc.
- Current Assignee: Precision Automation, Inc.
- Current Assignee Address: US WA Vancouver
- Agency: Kolisch Hartwell, P.C.
- Main IPC: G06F19/00
- IPC: G06F19/00 ; B23Q15/00 ; B23Q16/00 ; B26D1/18
Abstract:
A material processing system includes an apparatus having a processing path. A saw station is located along the processing path. A positioner is configured to push a trailing end of a work piece along the processing path toward the saw station. A computer is connected to the apparatus, and programmed to provide a digital interface allowing an operator to control operation of the apparatus through the interface.
Public/Granted literature
- US20080109101A1 Customizable job manager Public/Granted day:2008-05-08
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