A device for sealing between a first component and a second component is disclosed. The first component has a groove and the groove has a first wall and a second wall. The annular body includes a first side configured to selectively contact the first wall of the groove, a second side opposite the first side configured to selectively contact the second wall of the groove, a first surface in contact with the second component, and a second surface opposite the first surface. A lip is bonded to the second surface and extends at least partially around the second surface of the annular body. A pressure acting on the first side of the annular body forces the second side to contact the second wall of the groove, and a pressure acting on the second side of the annular body forces the first side to contact the first wall of the groove.