Invention Grant
US07794643B2 Apparatus and method for molding object with enhanced transferability of transfer face and object made by the same
有权
用于成型物体的设备和方法,具有增强的转印面和由其制成的物体的转印性
- Patent Title: Apparatus and method for molding object with enhanced transferability of transfer face and object made by the same
- Patent Title (中): 用于成型物体的设备和方法,具有增强的转印面和由其制成的物体的转印性
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Application No.: US11727121Application Date: 2007-03-23
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Publication No.: US07794643B2Publication Date: 2010-09-14
- Inventor: Jun Watanabe , Yasuo Yamanaka , Kiyotaka Sawada , Keiji Ueda , Yasunori Sugimoto
- Applicant: Jun Watanabe , Yasuo Yamanaka , Kiyotaka Sawada , Keiji Ueda , Yasunori Sugimoto
- Applicant Address: JP Tokyo
- Assignee: Ricoh Company, Ltd.
- Current Assignee: Ricoh Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Dickstein Shapiro LLP
- Priority: JP2006-082392 20060324
- Main IPC: B29C45/00
- IPC: B29C45/00 ; B32B9/04

Abstract:
A method of molding an object with a mold having a transfer face includes the steps of filling, separating, re-melting, re-contacting, cooling, and removing. The filling step fills a thermoplastic material, having a temperature greater than a softening temperature of the thermoplastic material, into a cavity space in the mold having a temperature smaller than the softening temperature of the thermoplastic material. The thermoplastic material comes in contact with the transfer face and is cooled. The separating step separates the transfer face from the thermoplastic material to form a heat-insulating layer between the thermoplastic material and transfer face. The re-melting step re-melts the thermoplastic material with heat energy retained inside the thermoplastic material. The re-contacting step re-contacts the re-melted thermoplastic material to the transfer face. The cooling step cools the thermoplastic material to a temperature smaller than the softening temperature of the thermoplastic material. The removing step removes the cooled thermoplastic material from the mold.
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