Invention Grant
- Patent Title: Silicon carbide single crystal, silicon carbide single crystal wafer, and method of production of same
- Patent Title (中): 碳化硅单晶,碳化硅单晶晶片及其制造方法
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Application No.: US10589680Application Date: 2004-12-27
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Publication No.: US07794842B2Publication Date: 2010-09-14
- Inventor: Masashi Nakabayashi , Tatsuo Fujimoto , Mitsuru Sawamura , Noboru Ohtani
- Applicant: Masashi Nakabayashi , Tatsuo Fujimoto , Mitsuru Sawamura , Noboru Ohtani
- Applicant Address: JP Tokyo
- Assignee: Nippon Steel Corporation
- Current Assignee: Nippon Steel Corporation
- Current Assignee Address: JP Tokyo
- Agency: Kenyon & Kenyon LLP
- International Application: PCT/JP2004/019812 WO 20041227
- International Announcement: WO2006/070480 WO 20060706
- Main IPC: B32B9/04
- IPC: B32B9/04 ; B32B13/04 ; B32B9/00 ; B32B19/00 ; C04B35/52 ; C04B35/56

Abstract:
The present invention provides a high resistivity, high quality, large size SiC single crystal, SiC single crystal wafer, and method of production of the same, that is, a silicon carbide single crystal containing uncompensated impurities in an atomic number density of 1 ×1015/cm3 or more and containing vanadium in an amount less than said uncompensated impurity concentration, silicon carbide single crystal wafer obtained by processing and polishing the silicon carbide single crystal and having an electrical resistivity at room temperature of 5×103 Ωcm or more, and a method of production of a silicon carbide single crystal.
Public/Granted literature
- US20080220232A1 Silicon Carbide Single Crystal, Silicon Carbide Single Crystal Wafer, and Method of Production of Same Public/Granted day:2008-09-11
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