Invention Grant
- Patent Title: Front-end processing of nickel plated bond pads
- Patent Title (中): 镀镍接合垫的前端加工
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Application No.: US12219836Application Date: 2008-07-29
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Publication No.: US07795093B2Publication Date: 2010-09-14
- Inventor: John Moore , Joseph F. Brooks
- Applicant: John Moore , Joseph F. Brooks
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Dickstein Shapiro LLP
- Main IPC: H01L21/336
- IPC: H01L21/336
Abstract:
A front-end method of fabricating nickel plated caps over copper bond pads used in a memory device. The method provides protection of the bond pads from an oxidizing atmosphere without exposing sensitive structures in the memory device to the copper during fabrication.
Public/Granted literature
- US20080299701A1 Front-end processing of nickel plated bond pads Public/Granted day:2008-12-04
Information query
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