Invention Grant
US07795198B2 Composition for removing a polymeric contaminant and method of removing a polymeric contaminant using the same
有权
用于除去聚合物污染物的组合物和使用其的去除聚合物污染物的方法
- Patent Title: Composition for removing a polymeric contaminant and method of removing a polymeric contaminant using the same
- Patent Title (中): 用于除去聚合物污染物的组合物和使用其的去除聚合物污染物的方法
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Application No.: US11840165Application Date: 2007-08-16
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Publication No.: US07795198B2Publication Date: 2010-09-14
- Inventor: Sang-Mi Lee , Kwang-Shin Lim , Jung-Dae Park , Tae-Hyo Choi
- Applicant: Sang-Mi Lee , Kwang-Shin Lim , Jung-Dae Park , Tae-Hyo Choi
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Mills & Onello, LLP
- Priority: KR10-2006-0080382 20060824
- Main IPC: H01L21/02
- IPC: H01L21/02
Abstract:
In a composition for removing a polymeric contaminant that may remain on an apparatus for manufacturing a semiconductor device and a method of removing a polymeric contaminant using the composition, the composition includes from about 5 to 10 percent by weight of a fluoride salt, from about 5 to 15 percent by weight of an acid or a salt thereof, and from about 75 to 90 percent by weight of an aqueous solution of glycol. The composition can effectively remove the polymeric contaminant from the apparatus within a relatively short period of time, and suppress damages to parts of the apparatus.
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