Invention Grant
- Patent Title: Low application temperature hot melt adhesive
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Application No.: US10273836Application Date: 2002-10-18
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Publication No.: US07795336B2Publication Date: 2010-09-14
- Inventor: Charles W. Paul , Matthew L. Sharak , Leisa A. Ryan , Maria Xenidou , Michael G. Harwell , Qiwei He
- Applicant: Charles W. Paul , Matthew L. Sharak , Leisa A. Ryan , Maria Xenidou , Michael G. Harwell , Qiwei He
- Applicant Address: DE Duesseldorf
- Assignee: Henkel AG & Co. KGaA
- Current Assignee: Henkel AG & Co. KGaA
- Current Assignee Address: DE Duesseldorf
- Agent Sun Hee Lehmann
- Main IPC: C08L91/06
- IPC: C08L91/06 ; C08K5/01 ; B32B27/04 ; B32B7/12

Abstract:
A low application temperature rubber-based hot melt adhesive having properties particularly well suited for use in the construction of disposable articles has been invented. The adhesive comprises a styrene block copolymer and a type of wax in an amount effective to produce a viscosity at 120° C. of below about 10,000 centipoises, a cube flow at 130° F. (54° C.) of less than about 300%, a DSC crystallization temperature of less than about 75° C. and a storage modulus of less than about 1.0×107 dynes/cm2 at 10 rads/sec (25° C.).
Public/Granted literature
- US20040077240A1 Low application temperature hot melt adhesive Public/Granted day:2004-04-22
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