Invention Grant
- Patent Title: Adhesive compositions for bonding and filling large assemblies
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Application No.: US11646664Application Date: 2006-12-28
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Publication No.: US07795351B2Publication Date: 2010-09-14
- Inventor: Samuel B. Osae , Paul C. Briggs
- Applicant: Samuel B. Osae , Paul C. Briggs
- Applicant Address: US CA Compton
- Assignee: IPS Corporation
- Current Assignee: IPS Corporation
- Current Assignee Address: US CA Compton
- Agent Scott R. Cox
- Main IPC: C08L9/00
- IPC: C08L9/00 ; C08L27/04 ; C08L33/04 ; C08L33/14 ; C08L35/02 ; C08L41/00
Abstract:
Adhesive composition for bonding and filling large assemblies, including a mixture of about 5 percent to about 75 percent by weight of a thermoplastic polymer, about 0.5 percent to about 35 percent by weight of a polyester resin or vinyl ester resin, and about 20 percent to about 80 percent by weight of an alkyl acrylate or methacrylate monomer.
Public/Granted literature
- US20070142556A1 Adhesive compositions for bonding and filling large assemblies Public/Granted day:2007-06-21
Information query
