Invention Grant
- Patent Title: Semiconductor memory device and manufacturing method thereof
- Patent Title (中): 半导体存储器件及其制造方法
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Application No.: US11677329Application Date: 2007-02-21
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Publication No.: US07795658B2Publication Date: 2010-09-14
- Inventor: Tomoaki Shino
- Applicant: Tomoaki Shino
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2006-053460 20060228; JP2006-277743 20061011
- Main IPC: H01L29/94
- IPC: H01L29/94

Abstract:
A semiconductor memory device includes a supporting substrate including semiconductor materials. The memory device also includes an insulation film provided above the supporting substrate. The memory device further includes a first diffusion layer provided on the insulation film. In addition, the memory device includes a second diffusion layer provided on the insulation film. The memory device additionally includes a body region provided between the first diffusion layer and the second diffusion layer. The body region is in an electrically floating state and accumulates or releases electric charges for storing data. Also, the memory device includes a semiconductor layer penetrating the insulation film and electrically connecting the second diffusion layer to the supporting substrate to release electric charges from the second diffusion layer. Further, the memory device includes a gate insulation film provided on the body region. Additionally, the memory device includes a gate electrode provided on the gate insulation film.
Public/Granted literature
- US20070200157A1 SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2007-08-30
Information query
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