Invention Grant
- Patent Title: Isolated lateral MOSFET in epi-less substrate
- Patent Title (中): 隔离式横向MOSFET在无外延衬底
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Application No.: US12002437Application Date: 2007-12-17
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Publication No.: US07795681B2Publication Date: 2010-09-14
- Inventor: Richard K. Williams , Donald Ray Disney , Wai Tien Chan
- Applicant: Richard K. Williams , Donald Ray Disney , Wai Tien Chan
- Applicant Address: US CA Santa Clara CN Hong Kong
- Assignee: Advanced Analogic Technologies, Inc.,Advanced Analogic Technologies (Hong Kong) Limited
- Current Assignee: Advanced Analogic Technologies, Inc.,Advanced Analogic Technologies (Hong Kong) Limited
- Current Assignee Address: US CA Santa Clara CN Hong Kong
- Agency: Patentability Associates
- Main IPC: H01L23/62
- IPC: H01L23/62

Abstract:
A lateral MOSFET formed in a substrate of a first conductivity type includes a gate formed atop a gate dielectric layer over a surface of the substrate, a drain region of a second conductivity type, a source region of a second conductivity type, and a body region of the first conductivity type which extends under the gate. The body region may have a non-monotonic vertical doping profile with a portion located deeper in the substrate having a higher doping concentration than a portion located shallower in the substrate. The lateral MOSFET may be drain-centric, with the source region and an optional dielectric-filled trench surrounding the drain region.
Public/Granted literature
- US20080237706A1 Lateral MOSFET Public/Granted day:2008-10-02
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