Invention Grant
- Patent Title: Flat substrate having an electrically conductive structure
- Patent Title (中): 具有导电结构的平坦基板
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Application No.: US12083916Application Date: 2006-10-13
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Publication No.: US07795693B2Publication Date: 2010-09-14
- Inventor: Heinz Kaufmann , Tobias Melz , Ralf Sindelar
- Applicant: Heinz Kaufmann , Tobias Melz , Ralf Sindelar
- Applicant Address: DE Munich
- Assignee: Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung E. V.
- Current Assignee: Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung E. V.
- Current Assignee Address: DE Munich
- Agency: Buchanan Ingersoll & Rooney PC
- Priority: DE102005050515 20051021
- International Application: PCT/EP2006/009927 WO 20061013
- International Announcement: WO2007/045408 WO 20070426
- Main IPC: H01L29/00
- IPC: H01L29/00

Abstract:
The description is of a flat substrate with an electrically conductive structure integrated inside the flat substrate or applied to a surface of the flat substrate and/or with a technically improved surface.The invention is characterised in that at least one sensor is integrated inside the flat substrate or applied to a surface of the flat substrate, which generates sensor signals according to deformations occurring inside the flat substrate, at least one actuator is integrated inside the flat substrate or applied to the surface of the flat substrate, which enables the flat substrate to mechanically deform when activated, and a signal unit connected to the at least one sensor and to the at least one actuator is provided, which, on the basis of the sensor signals, generates actuator signals for activating the actuator, so that deformations occurring inside the flat substrate are reduced.
Public/Granted literature
- US20080315941A1 Flat Substrate Having an Electrically Conductive Structure Public/Granted day:2008-12-25
Information query
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