Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US10865796Application Date: 2004-06-14
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Publication No.: US07795699B2Publication Date: 2010-09-14
- Inventor: Takehiro Ueda
- Applicant: Takehiro Ueda
- Applicant Address: JP Kanagawa
- Assignee: NEC Electronics Corporation
- Current Assignee: NEC Electronics Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Young & Thompson
- Priority: JP2003-183369 20030626; JP2004-168131 20040607
- Main IPC: H01L29/00
- IPC: H01L29/00
Abstract:
The semiconductor device of the present invention comprises a semiconductor substrate; and a conductive element formed on the semiconductor substrate and capable of being opened when a predetermined current flows, wherein the conductive element turns plurality of times.
Public/Granted literature
- US20040262710A1 Semiconductor device Public/Granted day:2004-12-30
Information query
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