Invention Grant
- Patent Title: Capped sensor
- Patent Title (中): 覆盖传感器
-
Application No.: US11039368Application Date: 2005-01-20
-
Publication No.: US07795723B2Publication Date: 2010-09-14
- Inventor: Kevin H.-L. Chau , Lawrence E. Felton , John A. Geen , Michael W. Judy , John R. Martin
- Applicant: Kevin H.-L. Chau , Lawrence E. Felton , John A. Geen , Michael W. Judy , John R. Martin
- Applicant Address: US MA Norwood
- Assignee: Analog Devices, Inc.
- Current Assignee: Analog Devices, Inc.
- Current Assignee Address: US MA Norwood
- Agency: Sunstein Kann Murphy & Timbers LLP
- Main IPC: H01L23/12
- IPC: H01L23/12

Abstract:
A sensor element is capped by bonding or otherwise forming a cap on a sensor element. The sensor may be hermetically sealed by using a hermetic cap and hermetic bonding material or by applying a hermetic coating. The sensor may be filled with a gas at an elevated pressure. The sensor may alternatively or additionally be filled with a special gas, such as a gas having a density-to-viscosity ratio above approximately 0.2.
Public/Granted literature
- US20050205959A1 Capped sensor Public/Granted day:2005-09-22
Information query
IPC分类: