Invention Grant
US07795726B2 Liquid cooled power electronic circuit comprising a stacked array of directly cooled semiconductor chips
有权
液冷式电力电子电路，包括直接冷却的半导体芯片的堆叠阵列
- Patent Title: Liquid cooled power electronic circuit comprising a stacked array of directly cooled semiconductor chips
- Patent Title (中): 液冷式电力电子电路，包括直接冷却的半导体芯片的堆叠阵列
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Application No.: US11799925Application Date: 2007-05-03
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Publication No.: US07795726B2Publication Date: 2010-09-14
- Inventor: Bruce A. Myers , Eric A. Brauer
- Applicant: Bruce A. Myers , Eric A. Brauer
- Applicant Address: US MI Troy
- Assignee: Delphi Technologies, Inc.
- Current Assignee: Delphi Technologies, Inc.
- Current Assignee Address: US MI Troy
- Agent Jimmy L. Funke
- Main IPC: H01L23/34
- IPC: H01L23/34
Abstract:
A stacked array of channeled semiconductor chips defining a power electronic circuit is mounted in a sealed container provided with inlet and outlet passages for liquid coolant. Leadframe terminals supported by the container engage selected terminals of the semiconductor chips and form leads for mounting the container on a circuit board having electrical and fluid interconnects.
Public/Granted literature
- US20080272484A1 Liquid cooled power electronic circuit comprising a stacked array of directly cooled semiconductor chips Public/Granted day:2008-11-06
Information query
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