Invention Grant
- Patent Title: Nitride semiconductor device
- Patent Title (中): 氮化物半导体器件
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Application No.: US12327874Application Date: 2008-12-04
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Publication No.: US07795738B2Publication Date: 2010-09-14
- Inventor: Katsuomi Shiozawa , Kyozo Kanamoto , Hiroshi Kurokawa , Yasunori Tokuda , Kyosuke Kuramoto , Hitoshi Sakuma
- Applicant: Katsuomi Shiozawa , Kyozo Kanamoto , Hiroshi Kurokawa , Yasunori Tokuda , Kyosuke Kuramoto , Hitoshi Sakuma
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Leydig, Voit & Mayer, Ltd.
- Priority: JP2007-317070 20071207
- Main IPC: H01L29/45
- IPC: H01L29/45 ; H01L21/20

Abstract:
A nitride semiconductor device with a p electrode having no resistance between itself and other electrodes, and a method of manufacturing the same are provided. A p electrode is formed of a first Pd film, a Ta film, and a second Pd film, and on a p-type contact layer of a nitride semiconductor. On the second Pd film, a pad electrode is formed. The second Pd film is formed on the entire upper surface of the Ta film which forms part of the p electrode, and serves as an antioxidant film that prevents oxidation of the Ta film. Preventing oxidation of the Ta film, the second Pd film can reduce the resistance that may exist between the p electrode and the pad electrode, thereby preventing a failure in contact between the p electrode and the pad electrode and providing the p electrode with low resistance.
Public/Granted literature
- US20090146308A1 NITRIDE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2009-06-11
Information query
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