Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US11851982Application Date: 2007-09-07
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Publication No.: US07795741B2Publication Date: 2010-09-14
- Inventor: Takashi Kikuchi , Koichi Kanemoto , Chuichi Miyazaki , Toshihiro Shiotsuki
- Applicant: Takashi Kikuchi , Koichi Kanemoto , Chuichi Miyazaki , Toshihiro Shiotsuki
- Applicant Address: JP Tokyo
- Assignee: Renesas Technology Corp.
- Current Assignee: Renesas Technology Corp.
- Current Assignee Address: JP Tokyo
- Agency: Miles & Stockbridge P.C.
- Priority: JP2006-255548 20060921
- Main IPC: H01L23/49
- IPC: H01L23/49
Abstract:
A semiconductor device which stores a plurality of semiconductor chips, having planar sizes which differ, in the same sealing body in a state in which they are accumulated via an insulating film which has an adhesive property. In the semiconductor device, the thickness of DAF of the back surface of the uppermost semiconductor chip with which the control circuit is formed is thicker than each of DAF of the back surface of the lower layer semiconductor chip with which the memory circuit is formed.
Public/Granted literature
- US20080251897A1 SEMICONDUCTOR DEVICE Public/Granted day:2008-10-16
Information query
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