Invention Grant
- Patent Title: Wiring substrate, electro optic device and electronic equipment
- Patent Title (中): 接线基板，电光设备和电子设备
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Application No.: US11330172Application Date: 2006-01-12
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Publication No.: US07795796B2Publication Date: 2010-09-14
- Inventor: Tomoyuki Kamakura
- Applicant: Tomoyuki Kamakura
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2005-009960 20050118
- Main IPC: H01J1/62
- IPC: H01J1/62
Abstract:
A wiring substrate includes; a wiring composed of a conductive film and formed on a substrate; and an insulating layer, wherein the insulating layer is arbitrarily arranged among the conductive films.
Public/Granted literature
- US20060157855A1 Wiring substrate, electro optic device and electronic equipment Public/Granted day:2006-07-20
Information query
