Invention Grant
- Patent Title: Probe device
- Patent Title (中): 探头设备
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Application No.: US12020251Application Date: 2008-01-25
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Publication No.: US07795889B2Publication Date: 2010-09-14
- Inventor: Erich Kolmhofer
- Applicant: Erich Kolmhofer
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dicke, Billig & Czaja, PLLC
- Main IPC: G01R31/02
- IPC: G01R31/02
Abstract:
A probe device for testing a semiconductor chip includes a substrate and a balun formed on the substrate. The balun includes first and second differential ports and a single-ended port. The probe device includes first and second probe tips respectively coupled to the first and second differential ports.
Public/Granted literature
- US20090189621A1 PROBE DEVICE Public/Granted day:2009-07-30
Information query
