Invention Grant
US07796317B2 Processing method and processing apparatus using interfered laser beams
有权
使用干涉激光束的处理方法和处理装置
- Patent Title: Processing method and processing apparatus using interfered laser beams
- Patent Title (中): 使用干涉激光束的处理方法和处理装置
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Application No.: US11914674Application Date: 2006-05-18
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Publication No.: US07796317B2Publication Date: 2010-09-14
- Inventor: Hideo Iwase
- Applicant: Hideo Iwase
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Canon U.S.A., Inc. I.P. Division
- Priority: JP2005-144937 20050518; JP2006-137088 20060516
- International Application: PCT/JP2006/310415 WO 20060518
- International Announcement: WO2006/123835 WO 20061123
- Main IPC: G02B26/00
- IPC: G02B26/00
Abstract:
Provided are a processing method and a processing apparatus which are capable of suppressing a disturbance attributable to a surface wave in a processing by interfered laser beams, in particular, a processing by the interfered laser beams of a pulsed laser having a pulse width of equal to or more than 1 fs and of equal to or less than 1 ps, in which the wavelength of a surface wave that propagates in a direction of the interference of the laser is made longer than a pitch of the interference of the laser on a surface of an object to be processed to process the object.
Public/Granted literature
- US20090103181A1 Processing Method and Processing Apparatus Using Interfered Laser Beams Public/Granted day:2009-04-23
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