Invention Grant
- Patent Title: Semiconductor laser device
- Patent Title (中): 半导体激光器件
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Application No.: US11494447Application Date: 2006-07-28
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Publication No.: US07796663B2Publication Date: 2010-09-14
- Inventor: Yasunobu Sugimoto , Masanao Ochiai , Akinori Yoneda
- Applicant: Yasunobu Sugimoto , Masanao Ochiai , Akinori Yoneda
- Applicant Address: JP Anan-shi
- Assignee: Nichia Corporation
- Current Assignee: Nichia Corporation
- Current Assignee Address: JP Anan-shi
- Agency: Morrison & Foerster LLP
- Main IPC: H01S5/00
- IPC: H01S5/00

Abstract:
To provide a semiconductor laser device which has no ripple and can afford better FFP having a pattern near a Gaussian distribution upon operation at the high output, the semiconductor laser comprising a laminate structure in which a first conductive type semiconductor layer, an active layer and a second conductive type semiconductor layer different from the first conductive type are laminated in this order, the laminate structure having a waveguide region to guide a light and resonator planes for laser oscillation on both ends, characterized in that the laminate structure has a non-resonator plane on one end side and the non-resonator plane is covered with a shading layer.
Public/Granted literature
- US20060262823A1 Semiconductor laser device Public/Granted day:2006-11-23
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