Invention Grant
- Patent Title: Thermal management system and associated method
- Patent Title (中): 热管理系统及相关方法
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Application No.: US11247113Application Date: 2005-10-11
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Publication No.: US07797808B2Publication Date: 2010-09-21
- Inventor: Jian Zhang , Sandeep Shrikant Tonapi , Ryan Christopher Mills , Arun Virupaksha Gowda
- Applicant: Jian Zhang , Sandeep Shrikant Tonapi , Ryan Christopher Mills , Arun Virupaksha Gowda
- Applicant Address: US NY Niskayuna
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Niskayuna
- Agent Andrew J. Caruso
- Main IPC: B23P25/00
- IPC: B23P25/00 ; B32B17/10
Abstract:
A method for making a thermal interface structure is provided. The method may include disposing a thermal transport layer on a resin layer to form a stacked structure, and slicing the stacked structure to form a cross-sectional slice having a first exposed portion of the thermal transport layer on a first surface of the slice, and a second exposed portion of the thermal transport layer on the second surface of the slice.
Public/Granted literature
- US20070240310A1 Thermal management system and associated method Public/Granted day:2007-10-18
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