Invention Grant
- Patent Title: High density component assembly method and apparatus
- Patent Title (中): 高密度组件装配方法及装置
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Application No.: US11967756Application Date: 2007-12-31
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Publication No.: US07797823B2Publication Date: 2010-09-21
- Inventor: Fabien Létourneau , Stefano DeCecco , Peter Serjak
- Applicant: Fabien Létourneau , Stefano DeCecco , Peter Serjak
- Applicant Address: FR Paris
- Assignee: Alcatel Lucent
- Current Assignee: Alcatel Lucent
- Current Assignee Address: FR Paris
- Agency: Wall & Tong, LLP
- Main IPC: H05K3/30
- IPC: H05K3/30
Abstract:
Apparatus and method for providing high density component assemblies, such as electromechanical or electro-optical assemblies.
Public/Granted literature
- US20090168348A1 HIGH DENSITY COMPONENT ASSEMBLY METHOD AND APPARATUS Public/Granted day:2009-07-02
Information query
