Invention Grant
- Patent Title: Floor profile arrangement for bridging a joint
- Patent Title (中): 用于桥接接头的地板型材布置
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Application No.: US10576887Application Date: 2007-02-07
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Publication No.: US07797900B2Publication Date: 2010-09-21
- Inventor: Frank Sondermann
- Applicant: Frank Sondermann
- Applicant Address: DE Ludenscheid
- Assignee: Herm. Friedr. Künne GmbH & Co.
- Current Assignee: Herm. Friedr. Künne GmbH & Co.
- Current Assignee Address: DE Ludenscheid
- Agency: Leffert Jay & Polglaze, P.A.
- Priority: DE10349932 20031024
- Main IPC: E04F19/02
- IPC: E04F19/02
Abstract:
A floor profile arrangement is provided, in particular for bridging a joint between adjacent floor coverings, with a base profile, a covering profile with at least one sideways projecting covering wing, and a web arrangement as a connection between the base profile and the covering profile, and with an articulation arrangement, the articulation arrangement consisting of an articular cavity disposed on the base profile or the covering profile and an articulation element formed on the lower or on the upper edge of the pivoting web arrangement.
Public/Granted literature
- US20080115441A1 Floor Profile Arrangement Comprising a Joint Public/Granted day:2008-05-22
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