Invention Grant
- Patent Title: Method of diffusion bonding a fluid flow apparatus
- Patent Title (中): 扩散接合流体流动装置的方法
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Application No.: US11756248Application Date: 2007-05-31
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Publication No.: US07798388B2Publication Date: 2010-09-21
- Inventor: Mark Crockett , John W. Lane , Vincent Kirchhoff , Marcel E. Josephson , Hong P. Gao , Bhaswan Manjunath
- Applicant: Mark Crockett , John W. Lane , Vincent Kirchhoff , Marcel E. Josephson , Hong P. Gao , Bhaswan Manjunath
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agent Shirley L. Church
- Main IPC: B23K20/00
- IPC: B23K20/00 ; B23K31/02 ; B23K1/20 ; B23K1/19
Abstract:
The present invention relates to a method of diffusion bonding of steel and steel alloys, to fabricate a fluid delivery system of the kind which would be useful in semiconductor processing and in other applications which require high purity fluid handling.
Public/Granted literature
- US20080296351A1 DIFFUSION BONDED FLUID FLOW APPARATUS USEFUL IN SEMICONDUCTOR MANUFACTURING Public/Granted day:2008-12-04
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