Invention Grant
- Patent Title: Tight package sensor seal
- Patent Title (中): 紧密封装传感器密封
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Application No.: US11687928Application Date: 2007-03-19
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Publication No.: US07798497B2Publication Date: 2010-09-21
- Inventor: John B. Wagner , Kane A. Myers , J. Brian Cloud
- Applicant: John B. Wagner , Kane A. Myers , J. Brian Cloud
- Applicant Address: US MI Plymouth
- Assignee: Freudenberg-NOK General Partnership
- Current Assignee: Freudenberg-NOK General Partnership
- Current Assignee Address: US MI Plymouth
- Agency: Harness, Dickey & Pierce, P.L.C
- Agent Ronald W. Wangerow
- Main IPC: F16J15/02
- IPC: F16J15/02

Abstract:
A tight package sensor seal includes a first seal portion engaging an outer surface of a sensor body and including a stop surface floatingly engaging a peripheral face surrounding a bore in a cover member. The first seal portion includes a reinforcing insert disposed therein. A second seal portion is axially spaced from the first seal portion and a flexible membrane extends axially between the first and second seal portions. The second seal portion engages an inner diameter of a bore in a cover member and includes a reinforcing insert therein. The sensor seal takes up a small radial space yet allows for radial offset of the sensor body relative to the bore of the cover member.
Public/Granted literature
- US20080231002A1 Tight Package Sensor Seal Public/Granted day:2008-09-25
Information query
IPC分类: