Invention Grant
- Patent Title: Fluid-ejection device service station
- Patent Title (中): 流体喷射装置维修站
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Application No.: US11679643Application Date: 2007-02-27
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Publication No.: US07798599B2Publication Date: 2010-09-21
- Inventor: Donald Lee Michael , William E. Lewey , Kevin E. Swier , Anthony D. Studer
- Applicant: Donald Lee Michael , William E. Lewey , Kevin E. Swier , Anthony D. Studer
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: B41J2/165
- IPC: B41J2/165

Abstract:
A service station for a fluid-ejection mechanism of a fluid-ejection device includes one or more mechanisms. The mechanisms move back and forth over the fluid-ejection mechanism to wipe the fluid-ejection mechanism. The mechanisms cap the fluid-ejection mechanism during periods of nonuse of the fluid-ejection mechanism. The service station is mounted on the fluid-ejection mechanism, and remains mounted on the fluid-ejection mechanism while the fluid-ejection mechanism is used to eject fluid onto media. The fluid-ejection device is moved by a user to properly eject the fluid onto the media.
Public/Granted literature
- US20080204507A1 Fluid-ejection device service station Public/Granted day:2008-08-28
Information query
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