Invention Grant
- Patent Title: Fluid ejection device metal layer layouts
- Patent Title (中): 流体喷射装置金属层布局
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Application No.: US11811094Application Date: 2007-06-08
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Publication No.: US07798616B2Publication Date: 2010-09-21
- Inventor: Kevin Bruce , Joseph M. Torgerson , Trudy Benjamin , Michael D. Miller
- Applicant: Kevin Bruce , Joseph M. Torgerson , Trudy Benjamin , Michael D. Miller
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: B41J2/045
- IPC: B41J2/045
Abstract:
A fluid ejection device comprises a first metal layer and a second metallayer. The first metal layer comprises an address path portion and a nonaddress path portion. The second metal layer, which overlies the first metal layer, comprises a first portion which comprises a power conducting portion. The power conducting portion is routed only over the non-address path portion of the first metal layer.
Public/Granted literature
- US20070242110A1 Fluid ejection device metal layer layouts Public/Granted day:2007-10-18
Information query
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