Invention Grant
- Patent Title: Dual-side imprinting lithography system
- Patent Title (中): 双面压印光刻系统
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Application No.: US12035702Application Date: 2008-02-22
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Publication No.: US07798802B2Publication Date: 2010-09-21
- Inventor: Eun-hyoung Cho , Sung-hoon Choa , Jin-seung Sohn , Du-hyun Lee
- Applicant: Eun-hyoung Cho , Sung-hoon Choa , Jin-seung Sohn , Du-hyun Lee
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2007-0087311 20070829
- Main IPC: B29C59/00
- IPC: B29C59/00 ; B29B13/08

Abstract:
Provided is a dual-side imprinting lithography system that includes a medium supporting unit that supports a medium wherein both surfaces of the medium are coated with a ultraviolet (UV) hardening resin; a first mold supporting unit and a second mold supporting unit that respectively support a first mold and a second mold, disposed respectively above the medium supporting unit and under the medium supporting unit; a vertical moving device that moves vertically at least one of the medium supporting unit, the first mold supporting unit, and the second mold supporting unit; a first UV radiating device that is installed above the first mold supporting unit to radiate UV rays; and a second UV radiating device that is installed under the second mold supporting unit to radiate UV rays.
Public/Granted literature
- US20090061035A1 DUAL-SIDE IMPRINTING LITHOGRAPHY SYSTEM Public/Granted day:2009-03-05
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