Invention Grant
- Patent Title: Electronic device and printed circuit board unit
- Patent Title (中): 电子设备和印刷电路板单元
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Application No.: US12230325Application Date: 2008-08-27
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Publication No.: US07798823B2Publication Date: 2010-09-21
- Inventor: Hideyuki Fujikawa , Hiromitsu Hagimoto
- Applicant: Hideyuki Fujikawa , Hiromitsu Hagimoto
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Staas & Halsey LLP
- Priority: JP2007-308874 20071129
- Main IPC: H01R12/00
- IPC: H01R12/00

Abstract:
The invention provides a printed circuit board including a first surface, a second surface which is a rear surface to the first surface, a connector installed on the first surface, and, formed between the first surface and the second surface, one of a through hole piercing the printed circuit board and a recess formed in an edge section of the printed circuit board; a cable including a first terminal that is removably fitted to the connector and a connecting wire portion located between the first terminal and a second terminal, the connecting wire portion extending from the first surface to the second surface of the printed circuit board through the one of the through hole and the recess when the first terminal is in a state of being fitted to the connector; and a casing for containing the printed circuit board and the cable.
Public/Granted literature
- US20090142955A1 Electronic device and printed circuit board unit Public/Granted day:2009-06-04
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