Invention Grant
US07798839B2 Casing mechanism and stacked circuit boards, and medical imaging apparatus and ultrasound endoscope using the same
有权
套管机构和堆叠电路板，以及使用其的医疗成像设备和超声内窥镜
- Patent Title: Casing mechanism and stacked circuit boards, and medical imaging apparatus and ultrasound endoscope using the same
- Patent Title (中): 套管机构和堆叠电路板，以及使用其的医疗成像设备和超声内窥镜
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Application No.: US12049831Application Date: 2008-03-17
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Publication No.: US07798839B2Publication Date: 2010-09-21
- Inventor: Toshihiro Kitahara
- Applicant: Toshihiro Kitahara
- Applicant Address: JP Tokyo
- Assignee: Olympus Medical Systems Corp.
- Current Assignee: Olympus Medical Systems Corp.
- Current Assignee Address: JP Tokyo
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Priority: JP2007-094201 20070330
- Main IPC: H01R12/00
- IPC: H01R12/00
Abstract:
A casing mechanism according to the present invention includes a first connector fixedly mounted on a first circuit board; a second connector fixedly mounted on a second circuit board; and a stress absorbing member which absorbs stresses produced in the first connector and the second connector when the first circuit board and the second circuit board are fastened to a casing with the first connector and the second connector interconnected.
Public/Granted literature
- US20080242981A1 CASING MECHANISM AND MEDICAL IMAGING APPARATUS AND ULTRASOUND ENDOSCOPE USING THE SAME Public/Granted day:2008-10-02
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