Invention Grant
- Patent Title: Minimally invasive joint implant with 3-dimensional geometry matching the articular surfaces
- Patent Title (中): 微创关节植入与3维几何匹配关节面
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Application No.: US10681749Application Date: 2003-10-07
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Publication No.: US07799077B2Publication Date: 2010-09-21
- Inventor: Philipp Lang , Daniel Steines , Hacene Bouadi , David Miller , Barry J. Linder , Cecily Anne Snyder
- Applicant: Philipp Lang , Daniel Steines , Hacene Bouadi , David Miller , Barry J. Linder , Cecily Anne Snyder
- Applicant Address: US MA Burlington
- Assignee: ConforMIS, Inc.
- Current Assignee: ConforMIS, Inc.
- Current Assignee Address: US MA Burlington
- Agency: Sunstein Kann Murphy & Timbers LLP
- Main IPC: A61F2/38
- IPC: A61F2/38
Abstract:
This invention is directed to orthopedic implants and systems. The invention also relates to methods of implant design, manufacture, modeling and implantation as well as to surgical tools and kits used therewith. The implants are designed by analyzing the articular surface to be corrected and creating a device with an anatomic or near anatomic fit; or selecting a pre-designed implant having characteristics that give the implant the best fit to the existing defect.
Public/Granted literature
- US20040138754A1 Minimally invasive joint implant with 3-Dimensional geometry matching the articular surfaces Public/Granted day:2004-07-15
Information query
IPC分类:
