Invention Grant
- Patent Title: Clay film
- Patent Title (中): 粘土电影
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Application No.: US10571107Application Date: 2004-09-08
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Publication No.: US07799395B2Publication Date: 2010-09-21
- Inventor: Takeo Ebina , Fujio Mizukami
- Applicant: Takeo Ebina , Fujio Mizukami
- Applicant Address: JP Tokyo
- Assignee: National Institute of Advanced Industrial Science and Technology
- Current Assignee: National Institute of Advanced Industrial Science and Technology
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2003-315780 20030908; JP2003-322644 20030916; JP2003-338378 20030929; JP2003-420028 20031217; JP2004-106756 20040331; JP2004-232919 20040810; JP2004-232950 20040810; JP2004-232964 20040810; JP2004-232983 20040810; JP2004-233680 20040810; JP2004-233892 20040810; JP2004-233898 20040810
- International Application: PCT/JP2004/013077 WO 20040908
- International Announcement: WO2005/023714 WO 20050317
- Main IPC: B32B27/08
- IPC: B32B27/08

Abstract:
The present invention provides a clay film with excellent flexibility, whose main component is natural clay or synthetic clay, and in which there is uniform orientation in the clay particle layer, and relates to a novel clay film that has enough mechanical strength to be used as a self-supporting film, and has a structure in which layers of clay particles are highly oriented, and in which the main constituent component of the clay film is mica, vermiculite, montmorillonite, iron montmorillonite, beidellite, saponite, hectorite, stevensite, or nontronite, and which has excellent flexibility, undergoes no structural change at high temperatures of 250° C. and up to 600° C., contains no pinholes, and has a gas permeation coefficient of less than 3.2×10−11 cm2s−1cmHg−1 at room temperature for helium, hydrogen, oxygen, nitrogen, or air.
Public/Granted literature
- US20070027248A1 Clay film Public/Granted day:2007-02-01
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