Invention Grant
- Patent Title: Conductive powder, conductive composition, and producing method of the same
- Patent Title (中): 导电粉末,导电组合物及其制备方法
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Application No.: US11411569Application Date: 2006-04-26
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Publication No.: US07799408B2Publication Date: 2010-09-21
- Inventor: Shigeo Hori , Hirohiko Furui , Tadashi Kubota , Yoshiaki Kubota
- Applicant: Shigeo Hori , Hirohiko Furui , Tadashi Kubota , Yoshiaki Kubota
- Applicant Address: JP Osaka
- Assignee: Kaken Tech Co. Ltd.
- Current Assignee: Kaken Tech Co. Ltd.
- Current Assignee Address: JP Osaka
- Agency: Carmody & Torrance LLP
- Priority: JP2001-053113 20010124; JP2002-319274 20021101; JP2002-319275 20021101
- Main IPC: B05D7/14
- IPC: B05D7/14

Abstract:
The present invention provides an Ag or Ni conductive powder, which can show the high conductivity even in condition that a resin is included and can has the narrow particle size distribution, and a conductive composition using the same, and a producing method of the same.In such an Ag or Ni conductive powder, a conductive composition and a producing method of the conductive powder, the conductive powder having a convex radially extended and a concave, wherein a core material which is at least one particle selected from the group consisting of an organic type particle, a metal type particle and a ceramic type particle is included into the conductive powder.
Public/Granted literature
- US20060226398A1 Conductive powder, conductive composition, and producing method of the same Public/Granted day:2006-10-12
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