Invention Grant
- Patent Title: Laminated structure, donor substrate, and method for fabricating laminated structure
- Patent Title (中): 叠层结构，供体基板和层叠结构的制造方法
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Application No.: US11314359Application Date: 2005-12-22
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Publication No.: US07799414B2Publication Date: 2010-09-21
- Inventor: Takayuki Yamada , Kazuaki Tabata
- Applicant: Takayuki Yamada , Kazuaki Tabata
- Applicant Address: JP Tokyo
- Assignee: Fuji Xerox Co., Ltd.
- Current Assignee: Fuji Xerox Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2005-169529 20050609
- Main IPC: B32B9/00
- IPC: B32B9/00
Abstract:
A laminated structure includes: a plurality of first electroconductive films each having a prescribed hardness; and a plurality of second electroconductive films each having a hardness that is lower than the prescribed hardness. The first and second electroconductive films are laminated alternately.
Public/Granted literature
- US20060280961A1 Laminated structure, donor substrate, and method for fabricating laminated structure Public/Granted day:2006-12-14
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