Invention Grant
- Patent Title: Sandwiched thermal solution
- Patent Title (中): 三明治热解决方案
-
Application No.: US10959416Application Date: 2004-10-06
-
Publication No.: US07799428B2Publication Date: 2010-09-21
- Inventor: Kikuo Fujiwara , Masaaki Tozawa , Gary D. Shives , Julian Norley , Robert Anderson Reynolds, III
- Applicant: Kikuo Fujiwara , Masaaki Tozawa , Gary D. Shives , Julian Norley , Robert Anderson Reynolds, III
- Applicant Address: US OH Parma
- Assignee: GrafTech International Holdings Inc.
- Current Assignee: GrafTech International Holdings Inc.
- Current Assignee Address: US OH Parma
- Agency: Waddey & Patterson, P.C.
- Agent James R. Cartiglia
- Main IPC: B32B9/00
- IPC: B32B9/00
Abstract:
A thermal solution for an electronic device, which is positioned between a heat source and an external surface of the electronic device and/or another component of the electronic device, where the thermal solution facilitates heat dissipation from the heat source while shielding the external surface and/or second component from the heat generated by the heat source.
Public/Granted literature
- US20060086493A1 Sandwiched thermal solution Public/Granted day:2006-04-27
Information query
