Invention Grant
- Patent Title: Silicone-based pressure-sensitive adhesive and adhesive tape
- Patent Title (中): 硅胶压敏胶和胶带
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Application No.: US11571404Application Date: 2005-06-20
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Publication No.: US07799433B2Publication Date: 2010-09-21
- Inventor: Akihiro Nakamura , Teruhito Maruyama
- Applicant: Akihiro Nakamura , Teruhito Maruyama
- Applicant Address: JP Tokyo
- Assignee: Dow Corning Toray Company, Ltd.
- Current Assignee: Dow Corning Toray Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Howard & Howard Attorneys PLLC
- Priority: JP2004-197477 20040702
- International Application: PCT/JP2005/011685 WO 20050620
- International Announcement: WO2006/003853 WO 20060112
- Main IPC: B32B9/04
- IPC: B32B9/04 ; C08L83/04

Abstract:
A silicone-based pressure-sensitive adhesive comprising: (A) a mixture or a product of partial condensation of (a) a raw rubberlike organopolysiloxane having an average of at least one alkenyl group per molecule and (b) an organopolysiloxane resin consisting essentially of R13SiO1/2 units and SiO4/2 units; (B) an organopolysiloxane having an average of at least two silicon-bonded hydrogen atoms per molecule; (C) a phenol-type oxidation inhibitor and/or a phenol-modified organosiloxane; (D) an aromatic amino-type oxidation inhibitor and/or aromatic amino-modified organosiloxane; and (E) a platinum-based catalyst, can form a pressure-sensitive adhesive layer that maintains good removability after being exposed to high temperatures.
Public/Granted literature
- US20070299216A1 Silicone-Based Pressure-Sensitive Adhesive and Adhesive Tape Public/Granted day:2007-12-27
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