Invention Grant
US07799506B2 Positive resist composition and pattern forming method using the same
有权
正型抗蚀剂组合物和使用其的图案形成方法
- Patent Title: Positive resist composition and pattern forming method using the same
- Patent Title (中): 正型抗蚀剂组合物和使用其的图案形成方法
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Application No.: US12240250Application Date: 2008-09-29
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Publication No.: US07799506B2Publication Date: 2010-09-21
- Inventor: Shuji Hirano , Shinichi Sugiyama
- Applicant: Shuji Hirano , Shinichi Sugiyama
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2007-256778 20070928
- Main IPC: G03F7/004
- IPC: G03F7/004 ; G03F7/30
Abstract:
A positive resist composition includes: (A) a resin containing a repeating unit represented by formula (I) as defined in the specification, of which solubility in an alkali developer increases under an action of an acid; and (B) a compound capable of generating an acid upon irradiation with actinic rays or radiation: and a pattern forming method uses the positive resist composition.
Public/Granted literature
- US20090087776A1 POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE SAME Public/Granted day:2009-04-02
Information query
IPC分类:
